The WRC-012 is a high-precision vertical-lift and rotation stage engineered specifically for wafer-chuck manipulation in semiconductor processing. Combining a wedge-based lift mechanism with a smooth, direct-drive rotary axis, the WRC-012 provides accurate, repeatable positioning for demanding semiconductor applications. Its compact, stable design maintains precision under load, while the integrated lift-and-rotate architecture simplifies system design and reduces stack-up errors. Ideal for inspection, metrology, and general wafer handling, the WRC-012 delivers reliable, high-performance motion in cleanroom environments.
| Vertical Position Accuracy (µm): | 5.0 |
|---|---|
| Vertical Position Repeatability (µm): | 1.0 |
| Maximum Liftiing Velocity (mm/s): | 10 |
| Rotational Position Accuracy (±arc-sec): | 30.0 |
| Rotational Position Repeatability (arc-sec): | 3.0 |
| Lifting Force (N): | 400 |
| Continuous Torque (Nm): | 1.56 |
| Payload Capacity (kg): | 20 |