The GXY-360 is a precision XY motion stage designed for demanding semiconductor processing and inspection applications. With 360 mm of travel in both axes, it is ideally sized for tools built for 300 mm wafers while providing ample travel for alignment, metrology, and wafer handling tasks. The stage features exceptional flatness and high structural rigidity, enabling stable motion and repeatable positioning even under demanding process conditions. While optimized for semiconductor wafer processing, the GXY’s combination of precision, stiffness, and travel range also makes it well suited for other precision automation, inspection, and advanced manufacturing applications.
| Accuracy (±µm): | Down to 17.0 (Encoder Dependent) |
|---|---|
| Calibrated Accuracy (±µm): | Down to 1.0 |
| Bi-Directional Repeatability (µm): | Down to 0.5 |
| Flatness/Straightness (µm): | 11.5 |
| Pitch/Yaw (±arc-sec): | 11.5 |
| XY Orthogonality (arc-sec): | 10.0 |
| Maximum Payload (kg): | 80 |
| Stage Mass (kg): | 68 |